Master's Thesis: NanoFlat-Metallization for RF Low-Loss Devices

About the role

Huawei Sweden R&D, in the MPE & Module Engineering Lab in Stockholm, is recruiting a master's student for a materials research project on nano-flat metallization for radio-frequency low-loss devices. The work focuses on achieving ultra-low surface roughness and reliable metallization on glass, ceramic and polymer substrates, with close collaboration with engineering teams in Sweden and Huawei's headquarters in China and hands-on research in university labs. Students must be available to start in spring 2027.

Key responsibilities

• Explore and optimize surface-smoothing techniques such as chemical-mechanical polishing and plasma treatments to significantly reduce substrate surface roughness.
• Develop robust, low-loss metal deposition strategies (for example sputtering, electroplating, seed-layer engineering) to ensure good electrical conductivity and strong adhesion of metal films under high-frequency operation.
• Produce process support for the next generation of low-loss RF and microwave devices.

Required profile

• Master's degree in Materials Science, radio frequency/microwave or electromagnetics.
• Strong spoken and written English.
• Able to work both in teams and independently, with a high attention to detail.
• Desirable: experience in chemical mechanical planarization and metallization of ultra-smooth ceramic and glass substrates, familiarity with multicultural work settings and experience in a lab or testing environment.